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  1. NxGEN Electronics; It's in the name.

    NxGen Electronics, Advanced Packaging Technologies
    CSP1
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    NxGen1
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    Nxgen San Diego1

    www.dodgedemonclub.com - 2009-04-03

  2. TESSERA TECHNOLOGIES

    UBGA, 3D packaging ball grid array, chip scale packaging, semiconductor packaging, multi-chip package, package stacking, system level integration. Tessera ...
    MCP2
    package design2
    CSP1
    BGA1
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    DDR II1
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    compliant chip1
    compliant layer1
    multi-chip1
    MBGA1
    microZ miniaturization1
    multi-chip package1
    package stacking1

    global.tessera.com - 2009-04-09

  3. signal integrity, high speed, IR drop, substrate design, flip chip, cavity down, power integrity, CO design, reliability modeling, 3D package, 3D packaging, ...

    3D packaging ball grid array, chip scale packaging, semiconductor packaging, multi-chip package, package stacking, system level integration. broadpak produces ...
    high speed2
    MCP2
    package design2
    CSP1
    BGA1
    memory modules1
    ball grid array1
    flip chip1
    signal integrity1
    advanced packaging1
    chip scale1
    DDR II1
    FBGA1
    chip scale package1
    3D packaging1
    land grid array1
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    die stacking1
    ball stack1
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    fine pitch BGA1
    MBGA1
    power integrity1
    CO design1
    IR drop1
    multi chip1
    reliability modeling1
    cavity down0
    memory stacking0
    multi chip package0
    substrate design0

    www.broadpak.com - 2009-02-11

  4. Welcome to BTU International - The Global Leader in Thermal Technology

    BTU International - Thermal expertise for electronics and materials processing
    Ceramic3
    Atmosphere2
    Continuous2
    Capacitors2
    Batch2
    Argon1
    BGA1
    Brazing1
    Annealing1
    Convection1
    BME1
    Aluminum Brazing1
    Chip Scale1
    Closed Loop Control1
    Chip scale packaging1
    Bright Annealing1
    Calcining1
    Capacitor arrays1
    Carbonizing1
    Convection Drying1
    Binder Burnout1
    Continuous Belt Furnaces1
    Controlled Atmosphere Brazing1
    Chip attach1
    Atmosphere Safety Systems1
    Capacitor Firing1
    Center Board Support1
    Ceramic Co-Firing1
    Chip Joining1
    Chip size packaging1
    Continuous Belt Ovens1

    www.atmoplas.com - 2009-02-07

csp1 design7 pcb2 abr2 circuit2 assembly2 engineering4 electronics4 manufacturing3 advanced packaging1 for sale4

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